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To support the growing interest in our activities, we are looking for an R&D engineer on polymer materials.
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Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact...
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As a R&D Engineer Thin Film Deposition, you will research and develop thin film deposition processes in imec’s 300mm pilot line to enable advanced materials for emerging applications, in close collaboration with the integration and device engineers.
What you will do
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You will gain fundamental understanding of ALD growth mechanisms, needed to develop materials for application in next generation memory devices.
What you will do
Imec investigates memory concepts with increased memory density to enable fast, low temperature and powerful...
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We are looking for a skillful and highly motivated postdoctoral researcher who obtained a PhD in computational chemistry/physics.
The candidate is expected to:
have an expertise in either [or both] electronic structure calculations (Time-Dependent Density...
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Extending the class of materials in CMOS fabrication
An ever-increasing number of materials are grown at temperatures that are too high for direct material integration in CMOS production lines. Other materials are grown on substrates that are incompatible with CMOS processing...
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Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
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You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...
Sponsored
You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices).
What you will do
Miniaturization of system size is a...
Sponsored
You will be responsible for developing new wafer bonding processes and participate in research activities where wafer to wafer bonding is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system size is a...
Sponsored
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will...
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